2023-12-19
Circuit boards are an indispensable and key component of modern electronic equipment. They have gone through a long and arduous development process
2023-11-29
Printed Circuit Board (PCB) is a substrate used to connect and support electronic components and is widely used in electronic products
2023-11-21
The packaging substrate industry is ushering in new development trends
In recent years, with the rapid development of the global logistics industry and the continuous optimization of the supply chain, packaging carrier boards, as an important loading tool in the logistics industry, are gradually becoming the focus of attention. The innovative design and technological application of packaging carrier boards are leading the development of the industry, providing more efficient and safer solutions for logistics and transportation.
2023-11-21
The latest development trends of the circuit board industry in 2023
In 2023, the circuit board industry will usher in a series of exciting new developments that will drive innovation and progress in the industry. The following is the latest industry news about the circuit board industry in 2023:
2023-02-10
What special process holes are there in PCB manufacturing?
Countersunk hole -- The transition part of the hole wall at the outermost/maximum aperture and the hole wall at the most small hole is parallel to the pcb surface, and the part connecting the large hole is a plane, not an inclined plane. The connecting part of the big hole is an inclined plane, not a plane. Note the angular (0-180 degree) control
2023-02-10
Three major factors causing welding defects of circuit board
Poor weldability of circuit board holes will produce virtual welding defects, affect the parameters of components in the circuit, lead to the instability of multilayer components and inner wire conduction, and cause the functional failure of the entire circuit. The so-called welderability is the property of the metal surface being wetted by molten solder, that is, the metal surface where the solder forms a layer of relatively uniform continuous smooth adhesion film.
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